Contact probe for improving contact with lead-free solder.
Compared to conventional BeCu products, it is equivalent or even superior, so wear resistance is not a concern.
At Seiken, in addition to our approach to surface treatment, we have re-evaluated the materials themselves. Traditionally, we used BeCu (beryllium copper), which required surface treatment. However, we have processed an alloy that excels in solder contact properties, allowing it to be used as is without any surface treatment. Even when cleaning the pin tips, the plating thickness is at most 1-2 micrometers, but since the alloy is used in its solid form, there is no risk of plating peeling that would expose the base material and degrade performance. Additionally, the hardness is comparable to or greater than that of traditional BeCu, so wear resistance is not a concern. This material can also be processed for probes in the P=80 micrometer class. *For more details, please refer to the PDF document or feel free to contact us.*
- Company：精研 本社
- Price：Other
